EVG 850LT SOI Fusion Wafer Bonder (Item ID: LES-9066)

EVG 850LT SOI Fusion Wafer Bonder (Item ID: LES-9066)

$0.00

Manufacturer: EVG
Model: 850LT SOI
Vintage 2017
Condition: used
Refurbishment, warranty, installation, training, service and support available
Available for full inspection and demonstration
Fully-Automatic
Suitable for wafer sizes up to 8"/200mm wafers
Currently configured for 8"/200mm wafers
One Cleaning Module
One Spinner Chuck for 8”/200mm wafers
One DI Water Dispense Line
One Genmark Robot with pre-aligner
One LowTemp Plasma Activation Module
High Frequency RF Generator with Matching Unit
Low Frequency RF Generator with Matching Unit
PC controlled with windows based graphical user interface
Password protected access levels
Programmable rotational speed for substrate cleaning
Operations Manual and Documentation included
PDF Operations Manual for EVG 850LT

Item ID: LES-9066

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