EVG 850 SOI Wafer Bonder (Item ID: LES-9055)
EVG 850 SOI Wafer Bonder (Item ID: LES-9055)
$0.00
Manufacturer: EVG
Model: 850
Vintage 2000
Condition: used
Refurbishment, warranty, installation, training, service and support available
Available for full inspection and demonstration
Fully-Automatic
Suitable for wafer sizes up to 6"/150mm wafers
Currently configured for 6"/150mm wafers
One Genmark Robot with pre-aligner
Two Cleaning Modules
One bonding station with high vacuum
Mechanical pre-aligner on bond station (pneumatically actuated)
PC controlled with windows based graphical user interface
Password protected access levels
Programmable rotational speed for substrate cleaning
Megasonic cleaning option
Operations Manual and Documentation included
PDF Operations Manual for EVG 850
Item ID: LES-9055
Quantity: