Manufacturer: EVG
Model: 520
Vintage 2000
Condition: used
Manual wafer load substrate bonder
Capable of fusion compression bonding
Capable of thermal compression bonding
Ideal for R&D and pilot production applications
High-vacuum capable bond chamber
Auto opening of bond tool cover
Windows based control software and operation interface
Wafer size: up to 6"/150mm capable
Max Bond Force: 20 kN
Top side heater: 550°C max. in 1°C steps
Bottom side heater: 550°C max. in 1°C steps
Chiller
Temperature uniformity: ± 1,5 %
Turbo pump and controller
Roughing pump
Load/unload tool
System computer, monitor, and keyboard
PDF Operations Manual for EVG 520 Bonder

Item ID: LES-9051