EVG 520 Wafer Bonder (Item ID: LES-9051)
![LES-9051 thumbnail.jpg](https://images.squarespace-cdn.com/content/v1/5cd8242f7d0c912d598456c0/1697205134383-4HA9WPM9O4T4JKFE2KLW/LES-9051+thumbnail.jpg)
![LES-9051b.jpg](https://images.squarespace-cdn.com/content/v1/5cd8242f7d0c912d598456c0/1697205151829-E5OH4LR3M076Z3Y6AO91/LES-9051b.jpg)
![LES-9051c.jpg](https://images.squarespace-cdn.com/content/v1/5cd8242f7d0c912d598456c0/1697205151444-JPQR8J7OMDIZ102HPM2S/LES-9051c.jpg)
![LES-9051d.jpg](https://images.squarespace-cdn.com/content/v1/5cd8242f7d0c912d598456c0/1697205151677-25VERF6J2LQIYCZFG1EY/LES-9051d.jpg)
![LES-9051e.jpg](https://images.squarespace-cdn.com/content/v1/5cd8242f7d0c912d598456c0/1697205151930-TUY4GGBFT3C656T5F1QL/LES-9051e.jpg)
![LES-9051g.jpg](https://images.squarespace-cdn.com/content/v1/5cd8242f7d0c912d598456c0/1697205152121-F2X7LQDOHVLKX1G9688W/LES-9051g.jpg)
EVG 520 Wafer Bonder (Item ID: LES-9051)
$0.00
Manufacturer: EVG
Model: 520
Vintage 2000
Condition: used
Manual wafer load substrate bonder
Capable of fusion compression bonding
Capable of thermal compression bonding
Ideal for R&D and pilot production applications
High-vacuum capable bond chamber
Auto opening of bond tool cover
Windows based control software and operation interface
Wafer size: up to 6"/150mm capable
Max Bond Force: 40 kN
Top side heater: 550°C max. in 1°C steps
Bottom side heater: 550°C max. in 1°C steps
Chiller
Temperature uniformity: ± 1,5 %
Turbo pump and controller
Roughing pump
Load/unload tool
System computer, monitor, and keyboard
PDF Operations Manual for EVG 520 Bonder
Item ID: LES-9051
Quantity: