Manufacturer: EVG
Model: 501
Condition: used
Refurbishment, warranty, installation, training, service and support available
Available for full inspection and demonstration
Manual wafer load substrate bonder
Capable of fusion compression bonding
Capable of thermal compression bonding
Capable of anodic bonding
Ideal for R&D and pilot production applications
High-vacuum capable bond chamber
Windows based control software and operation interface
Wafer size: up to 6”/150mm
Max Bond Force: 7 kN
Top side heater: 550°C max. in 1°C steps
Bottom side heater: 550°C max. in 1°C steps
Temperature uniformity: ± 1,5 %
Turbo pump and controller
Roughing pump
Load/unload tool
System computer, monitor, and keyboard
PDF Operations Manual for EVG 501 Bonder

Item ID: LES-9045